Investigation on an integrated liquid cooling system in LTCC-multilayer

Thermal management is one of the most important problems of electronic packaging design. Different concepts are discussed for material selection and design for LTCC modules. This paper gives an overview of the experimental and simulation results of a special concept with an integrated liquid cooling system in the LTCC multilayer. This concept, based on the integration of a channel system direct into the ceramic multilayer wiring board, allows large heat transfer from chip bond area to a heat sink. Some aspects of design and technology of such a channel pattern are discussed, along with results of experimental investigations on test multilayers. The main topics include the measurement and simulation results of some aspects in order to analyze the behavior and obtain optimization of such a set-up. The influences of the channel pattern and shape, liquid flow and multilayer design are demonstrated. Experiments with test modules have shown the real possibilities of such a concept. Optimized test modules allow applications with power dissipation of about 50 W/cm²