DocumentCode :
1747100
Title :
Performance analysis of a rapid thermal processor via physics-based modeling and convex optimization
Author :
Kim, S.J. ; Kang, S.B. ; Hyun, S.Y. ; Cho, Y.M. ; Chung, J.D. ; Lee, J.S. ; Jung, C.H. ; Choi, Y.J. ; Jung, K.R.
Author_Institution :
Sch. of Mech. & Aerosp. Eng., Seoul Nat. Univ., South Korea
Volume :
2
fYear :
2001
fDate :
2001
Firstpage :
1213
Abstract :
Rapid thermal processing (RTP) is a key fabrication technology in the advanced cluster tool. Ever-decreasing feature sizes require extremely tight process control, which rely on a good chamber design. The empirical approach to the RTP design has its own limitations in two areas, although widely adopted and successful in delivering necessary performance specifications: (1) reduction in time-to-market and development cost and (2) quantification of performance limits. With the advent of powerful computing resources at relatively low cost, a model-based approach provides an alternative and has better chance to achieve optimal design by virtue of its capability to quantify performance limits at minimal time and cost. In an effort to realize the model-based approach, a physics-based model is derived and validated against experimental data. With a predictive model available, the performances of an RTP design are analyzed via convex optimization to qualify an RTP design, which also serves as a basis for control implementation once the RTP design parameters are set
Keywords :
optimisation; rapid thermal processing; semiconductor technology; RTP design parameters; chamber design; convex optimization; development cost reduction; heat transfer modes; model-based approach; optimal design; performance analysis; performance limits quantification; physics-based model; physics-based modeling; predictive model; process control; rapid thermal processing; rapid thermal processor; reduced order modelling; time-to-market reduction; Costs; Design methodology; Geometry; Performance analysis; Predictive models; Process control; Rapid thermal processing; Semiconductor device modeling; Solid modeling; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics, 2001. Proceedings. ISIE 2001. IEEE International Symposium on
Conference_Location :
Pusan
Print_ISBN :
0-7803-7090-2
Type :
conf
DOI :
10.1109/ISIE.2001.931652
Filename :
931652
Link To Document :
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