DocumentCode :
1747113
Title :
An experimentally validated electro-thermal compact model for 4H-SiC power diodes
Author :
Kolessar, R. ; Nee, H.P.
Author_Institution :
Dept. of Electr. Eng., R. Inst. of Technol., Stockholm, Sweden
Volume :
2
fYear :
2001
fDate :
2001
Firstpage :
1345
Abstract :
The implementation of a circuit-oriented model for high-current, high-voltage 4H-SiC power diodes is presented. The compact modeling technique used presents a good trade-off between accuracy and speed for modeling of bipolar power devices, and a high flexibility for inclusion of various physical models. Implementation in the SABER circuit simulator of the model is performed using the MAST hardware description language (HDL). Up-to-date physical models for 4H-SiC semiconductor materials including thermal dependence, which are relevant for the device switching behavior are evaluated and implemented in the compact model. Simulation results using the proposed model are compared to both measurements and device simulations on 2.5 kV, 400 A Si-IGBT/4H-SiC diode modules from ABB at various circuit and temperature conditions. The model has proven to be a valuable simulation tool for investigation of future power circuit designs based on SiC technology
Keywords :
circuit simulation; power semiconductor diodes; power semiconductor switches; semiconductor device models; silicon compounds; thermal analysis; 2.5 kV; 400 A; 4H-SiC power diodes; 4H-SiC semiconductor materials; H-SiC; MAST hardware description language; SABER circuit simulator; bipolar power devices; circuit-oriented model; compact modeling technique; device switching behavior; electro-thermal compact model; modelling accuracy; modelling speed; thermal dependence; Analytical models; Circuit simulation; Costs; Hardware design languages; Plasmas; Polynomials; Power electronics; Power system modeling; Semiconductor diodes; Silicon carbide;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics, 2001. Proceedings. ISIE 2001. IEEE International Symposium on
Conference_Location :
Pusan
Print_ISBN :
0-7803-7090-2
Type :
conf
DOI :
10.1109/ISIE.2001.931677
Filename :
931677
Link To Document :
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