The modeling and control of the cluster tool in semiconductor fabrication

Author

Huang, Han-Pang ; Wang, Che-Lung

Author_Institution

Dept. of Mech. Eng., Nat. Taiwan Univ., Taipei, Taiwan

Volume

2

fYear

2001

fDate

2001

Firstpage

1826

Abstract

A single wafer processing IC fabrication with flexible and distributed configuration is becoming more important. The cluster tool is such an IC fabrication equipment. It consists of a cassette module, transport module, and process module. In the paper, the model of a cluster tool is constructed using a distributed colored timed Petri net. The emulator and controller of the cluster tool are further constructed. The standards of SECS, HSMS and GEM are used to develop the intelligent module controller. Finally, a web-based remote controller is developed and the SPC module is built in the cluster tool.

Keywords

Internet; Petri nets; graph colouring; integrated circuit manufacture; intelligent control; statistical process control; telecontrol; GEM; HSMS; SECS; SPC module; cassette module; cluster tool; distributed colored timed Petri net; flexible distributed configuration; intelligent module controller; process module; semiconductor fabrication; single wafer processing IC fabrication; transport module; web-based remote controller; Communication system control; Control systems; Fabrication; Internet; Laboratories; Mechanical engineering; Robots; Semiconductor device manufacture; Semiconductor device modeling; Virtual manufacturing;

fLanguage

English

Publisher

ieee

Conference_Titel

Robotics and Automation, 2001. Proceedings 2001 ICRA. IEEE International Conference on

ISSN

1050-4729

Print_ISBN

0-7803-6576-3

Type

conf

DOI

10.1109/ROBOT.2001.932874

Filename

932874