DocumentCode :
1747468
Title :
The modeling and control of the cluster tool in semiconductor fabrication
Author :
Huang, Han-Pang ; Wang, Che-Lung
Author_Institution :
Dept. of Mech. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Volume :
2
fYear :
2001
fDate :
2001
Firstpage :
1826
Abstract :
A single wafer processing IC fabrication with flexible and distributed configuration is becoming more important. The cluster tool is such an IC fabrication equipment. It consists of a cassette module, transport module, and process module. In the paper, the model of a cluster tool is constructed using a distributed colored timed Petri net. The emulator and controller of the cluster tool are further constructed. The standards of SECS, HSMS and GEM are used to develop the intelligent module controller. Finally, a web-based remote controller is developed and the SPC module is built in the cluster tool.
Keywords :
Internet; Petri nets; graph colouring; integrated circuit manufacture; intelligent control; statistical process control; telecontrol; GEM; HSMS; SECS; SPC module; cassette module; cluster tool; distributed colored timed Petri net; flexible distributed configuration; intelligent module controller; process module; semiconductor fabrication; single wafer processing IC fabrication; transport module; web-based remote controller; Communication system control; Control systems; Fabrication; Internet; Laboratories; Mechanical engineering; Robots; Semiconductor device manufacture; Semiconductor device modeling; Virtual manufacturing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Robotics and Automation, 2001. Proceedings 2001 ICRA. IEEE International Conference on
ISSN :
1050-4729
Print_ISBN :
0-7803-6576-3
Type :
conf
DOI :
10.1109/ROBOT.2001.932874
Filename :
932874
Link To Document :
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