Using conduction modes basis functions for efficient electromagnetic analysis of on-chip and off-chip interconnect

In this paper, we present an efficient method to model the interior of the conductors in a quasi-static or full-wave integral equation solver. We show how interconnect cross-sectional current distributions can be modeled using a small number of conduction modes as basis functions for the discretization of the mixed potential integral equation (MPIE). Two examples are presented to demonstrate the computational attractiveness of our method. In particular, we show how our new approach can successfully and efficiently capture skin effects, proximity effects and transmission line resonances.