Development of ElectroChemical deposition (ECD) Pt film as a BST capacitor electrode

Author

Kong, Kris ; Choi, H.B. ; Cho, H.-J. ; Yu, Y.S. ; Roh, J.S. ; Yoon, H.K.

Author_Institution

Memory R&D Div., Hyundai Electron. Industries Co., Ltd, Kyoungki, South Korea

Volume

1

fYear

2000

fDate

2000

Firstpage

361

Abstract

The ECD Pt process has been developed for BST capacitor electrode applications. This process has many advantages for BST capacitor integration such as selective deposition, high conformality, and low cost. Selective deposition makes it possible to form high Pt stack structures without Pt dry etch processes. Various properties of the ECD Pt film and electrical properties of CVD BST deposited on ECD Pt electrodes are described

Keywords

barium compounds; conformal coatings; electrodeposition; electrodes; ferroelectric capacitors; metallic thin films; platinum; strontium compounds; BST capacitor electrode; BST capacitor integration; BaSrTiO₃; CVD BST; Pt; electrical properties; electrochemical deposition Pt film; high Pt stack structure; high conformality; low cost; selective deposition; Annealing; Binary search trees; Capacitors; Cathodes; Conductivity; Costs; Electrodes; Etching; Polarization; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Applications of Ferroelectrics, 2000. ISAF 2000. Proceedings of the 2000 12th IEEE International Symposium on

Conference_Location

Honolulu, HI

ISSN

1099-4734

Print_ISBN

0-7803-5940-2

Type

conf

DOI

10.1109/ISAF.2000.941572

Filename

941572