• DocumentCode
    1750024
  • Title

    Development of highly textured piezoelectric ceramics via templated grain growth

  • Author

    Seabaugh, M.M. ; Cheney, G.L. ; Hasinska, K. ; Dawson, W.J. ; Swartz, S.L.

  • Author_Institution
    NexTech Mater. Ltd., Worthington, OH, USA
  • Volume
    1
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    377
  • Abstract
    Textured polycrystalline piezoelectric materials are expected to provide improved properties compared to untextured ceramics, and low processing costs compared to single crystals. NexTech Materials is developing textured polycrystalline piezoelectric ceramics via Templated Grain Growth (TGG). In the TGG process, a number of large anisotropic template particles are oriented in a fine particle matrix in the green state, and grow during heat treatment, consuming the surrounding matrix grains and creating a crystallographically oriented ceramic. The keys to TGG processing are the development of the template and matrix components. Templates should be large, anisotropic and crystallographically isostructural with the matrix material. The matrix should be high surface area to provide sufficient driving force for densification and grain growth. The development of both components and their integration for the PMN-PT system be discussed
  • Keywords
    densification; grain growth; heat treatment; lead compounds; piezoceramics; texture; PMN-PT system; PMN-PbTiO3; PbMgO3NbO3-PbTiO3; anisotropic particles; crystallographic orientation; densification; green state; heat treatment; polycrystalline material; surface area; templated grain growth; textured piezoelectric ceramic; Anisotropic magnetoresistance; Ceramics; Costs; Crystalline materials; Crystallization; Crystallography; Crystals; Heat treatment; Piezoelectric materials; Powders;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applications of Ferroelectrics, 2000. ISAF 2000. Proceedings of the 2000 12th IEEE International Symposium on
  • Conference_Location
    Honolulu, HI
  • ISSN
    1099-4734
  • Print_ISBN
    0-7803-5940-2
  • Type

    conf

  • DOI
    10.1109/ISAF.2000.941575
  • Filename
    941575