Title :
High-Q 3D RF solenoid inductors in glass
Author :
Kim, Jung-Ho ; Shenoy, Renuka ; Kwan-yu Lai ; Jonghae Kim
Author_Institution :
Qualcomm Inc., San Diego, CA, USA
Abstract :
In this paper, we demonstrate the fabrication and characterization of various 3D solenoid inductors using a glass core substrate. Solenoid inductors were fabricated in glass by drilling through holes in glass and semi-additive copper plating for metallization. This topology is compared to similar solenoid structures in terms of Q-factor performance and inductance density. Inductances of 1.8-4.5nH with Q ~ 60 at 1GHz were demonstrated.
Keywords :
drilling; glass; inductors; metallisation; solenoids; Q-factor performance; frequency 1 GHz; glass core substrate; high-Q 3D RF solenoid inductors; inductance density; metallization; semiadditive copper plating; solenoid structures; Glass; Inductance; Inductors; Integrated circuit modeling; Radiofrequency integrated circuits; Solenoids; Three-dimensional displays; Solenoids; Thru-Glass Via (TGV);
Conference_Titel :
Radio Frequency Integrated Circuits Symposium, 2014 IEEE
Conference_Location :
Tampa, FL
Print_ISBN :
978-1-4799-3862-9
DOI :
10.1109/RFIC.2014.6851696
