• DocumentCode
    175169
  • Title

    High-Q 3D RF solenoid inductors in glass

  • Author

    Kim, Jung-Ho ; Shenoy, Renuka ; Kwan-yu Lai ; Jonghae Kim

  • Author_Institution
    Qualcomm Inc., San Diego, CA, USA
  • fYear
    2014
  • fDate
    1-3 June 2014
  • Firstpage
    199
  • Lastpage
    200
  • Abstract
    In this paper, we demonstrate the fabrication and characterization of various 3D solenoid inductors using a glass core substrate. Solenoid inductors were fabricated in glass by drilling through holes in glass and semi-additive copper plating for metallization. This topology is compared to similar solenoid structures in terms of Q-factor performance and inductance density. Inductances of 1.8-4.5nH with Q ~ 60 at 1GHz were demonstrated.
  • Keywords
    drilling; glass; inductors; metallisation; solenoids; Q-factor performance; frequency 1 GHz; glass core substrate; high-Q 3D RF solenoid inductors; inductance density; metallization; semiadditive copper plating; solenoid structures; Glass; Inductance; Inductors; Integrated circuit modeling; Radiofrequency integrated circuits; Solenoids; Three-dimensional displays; Solenoids; Thru-Glass Via (TGV);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radio Frequency Integrated Circuits Symposium, 2014 IEEE
  • Conference_Location
    Tampa, FL
  • ISSN
    1529-2517
  • Print_ISBN
    978-1-4799-3862-9
  • Type

    conf

  • DOI
    10.1109/RFIC.2014.6851696
  • Filename
    6851696