Title :
Reliability modeling incorporating error processes for Internet-distributed software
Author :
Lo, Jug-Hua ; Kuo, Sy-Yen ; Huang, Chin-Yu
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Abstract :
The paper proposes several improvements to conventional software reliability growth models (SRGMs) to describe actual software development processes by eliminating an unrealistic assumption that detected errors are immediately corrected. A key part of the proposed models is the "delay-effect factor", which measures the expected time lag in correcting the detected faults during software development. To establish the proposed model, we first determine the delay-effect factor to be included In the actual correction process. For the conventional SRGMs, the delay-effect factor is basically non-decreasing. This means that the delayed effect becomes more significant as time moves forward. Since this phenomenon may not be reasonable for some applications, we adopt a bell-shaped curve to reflect the human learning process in our proposed model. Experiments on a real data set for Internet-distributed software has been performed, and the results show that the proposed new model gives better performance in estimating the number of initial faults than previous approaches
Keywords :
Internet; software quality; software reliability; Internet-distributed software; SRGMs; delay-effect factor; delayed effect; detected errors; detected faults; error correction process; error processes; expected time lag; fault detection/correction processes; human learning process; real data set; reliability modeling; software development; software development process; software reliability growth models; Application software; Delay effects; Error correction; Fault detection; Humans; Internet; Programming; Software measurement; Software reliability; Time measurement;
Conference_Titel :
TENCON 2001. Proceedings of IEEE Region 10 International Conference on Electrical and Electronic Technology
Print_ISBN :
0-7803-7101-1
DOI :
10.1109/TENCON.2001.949540