Title :
Three-Dimensional Metal Patterning over Nanostructures by Reversal Imprint
Author :
Peng, C. ; Pan, S.W.
Author_Institution :
Department of Electrical Engineering and Computer Science, The University of Michigan, Ann Arbor, MI 48109
Abstract :
Metal patterning is a key technology in semiconductor and biomedical devices fabrication. A simple process for patterning three-dimensional (3D) metal structures over nanostructures is developed. Metal patterns of 50/20 nm thick Au/Ti and 0.5 μm thick Al have been transferred to SU-8 and Si structures by reversal imprint. 3D structures in metal have also been demonstrated.
Keywords :
metal patterning; nanoimprint; three-dimensional nanostructures; Dry etching; Fabrication; Glass; Gold; Inorganic materials; Optical polymers; Printing; Semiconductor nanostructures; Substrates; Surfaces; metal patterning; nanoimprint; three-dimensional nanostructures;
Conference_Titel :
Nanotechnology, 2006. IEEE-NANO 2006. Sixth IEEE Conference on
Print_ISBN :
1-4244-0077-5
DOI :
10.1109/NANO.2006.247566
