DocumentCode :
1753440
Title :
Efficient high-speed optoelectronic interconnects parameter extraction based on 3D field simulation
Author :
Ukaegbu, Ikechi Augustine ; Lee, Tae-Woo ; Park, Hyo-Hoon
Author_Institution :
Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon, South Korea
fYear :
2011
fDate :
13-16 Feb. 2011
Firstpage :
244
Lastpage :
247
Abstract :
As the speed of integrated circuits increases, inductive coupling becomes an issue for the packaging interconnect technologies. This paper describes equivalent circuit extraction based on 3D full wave simulation for optoelectronic transmitter packaging interconnects. Simulation and extraction are performed for two kinds of transmitter modules: planar and multi-chip modules. The extracted equivalent circuit model of the optoelectronic interconnects is accurate and can be applied in packaging design state-of-the-art.
Keywords :
electronics packaging; equivalent circuits; integrated optoelectronics; optical interconnections; 3D field simulation; 3D full wave simulation; efficient high-speed optoelectronic interconnect parameter extraction; equivalent circuit extraction; optoelectronic transmitter packaging interconnects; packaging design; Capacitance; Crosstalk; Equivalent circuits; Integrated circuit interconnections; Integrated circuit modeling; Optical transmitters; Vertical cavity surface emitting lasers; Optical interconnection; crosstalk; multichip module; planar module;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Communication Technology (ICACT), 2011 13th International Conference on
Conference_Location :
Seoul
ISSN :
1738-9445
Print_ISBN :
978-1-4244-8830-8
Type :
conf
Filename :
5745786
Link To Document :
بازگشت