Title :
Optoelectronic subcarrier for chip-to-chip optical PCB applications using long wavelength VCSELs
Author :
Ukaegbu, Ikechi Augustine ; Lee, Tae-Woo ; Cho, Mu Hee ; Park, Hyo-Hoon
Author_Institution :
Photonics Comput. Syst. Lab., Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon, South Korea
Abstract :
An interconnection scheme for chip-to-chip optical link has been proposed in this work where the silicon substrate of the driver integrated circuit (IC) is used as a subcarrier and also as a light path. This interconnection scheme uses a low loss high speed reconfigurable optical printed circuit board (REOPCB) for coupling light from one chip to the other. A multichip transmitter module has been fabricated with a 1 × 4 top-emitting long wavelength (1310 nm) VCSEL array integrated on it. The driver IC is fabricated in a 0.18 μm Si-CMOS technology with a chip size of 1.1 mm × 1.2 mm × 0.322 mm. 72% of the emitted light from the VCSEL is achieved after transmission through the silicon substrate.
Keywords :
CMOS integrated circuits; driver circuits; flip-chip devices; integrated optoelectronics; multichip modules; optical interconnections; printed circuit manufacture; surface emitting lasers; CMOS technology; REOPCB; VCSEL array; chip-to-chip optical PCB applications; chip-to-chip optical link; coupling light; driver IC; driver integrated circuit; interconnection scheme; multichip transmitter module; optoelectronic subcarrier; reconfigurable optical printed circuit board; silicon substrate; size 0.18 mum; top-emitting long wavelength; wavelength 1310 nm; wavelength VCSEL; High speed optical techniques; Integrated optics; Optical device fabrication; Optical interconnections; Optical transmitters; Silicon; Vertical cavity surface emitting lasers; Multichip module; flip-chip bonding; optical interconnection; optical printed circuit board (OPCB);
Conference_Titel :
Advanced Communication Technology (ICACT), 2011 13th International Conference on
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-8830-8
