DocumentCode :
1753601
Title :
Improve IPv6 global connectivity for 6LoWPAN
Author :
Choi, Dae In ; Park, Jong-tak ; Kim, Su Yeon ; Kahng, Hyun K.
Author_Institution :
Dept. of Electron. & Inf., Korea Univ., Seoul, South Korea
fYear :
2011
fDate :
13-16 Feb. 2011
Firstpage :
1007
Lastpage :
1010
Abstract :
IEEE 802.15.4 has limitations as short range, low bit rate, low power, and low cost. And IEEE 802.15.4 devices have limitation as computational power, memory, and/or energy availability. IEEE802.15.4 standard´s MTU is 127 bytes, among which IEEE 64 bits extended addresses may be used. After an association, 16 bits are used as an unique ID in a PAN L2, Still only 102 bytes are available for payload at MAC layer. Now considering the devices need to communicate with other nodes, 256 bits of the source and destination addresses seem to be cumbersome in a limited MAC payload fields. Therefore 6LoWPAN proposes that the nodes use the compress packet header for solving short MTU. But 6LoWPAN has limitation that in case of communication with dissimilar network. When a 6LoWPAN device communicates with Internet spend 128 bits in destination address. Therefore, we propose a new IPv6 address translation mechanism between IPv6 and ID. This mechanism has ID query and reply for external node. This paper will explain the detailed procedures and performance.
Keywords :
IEEE standards; IP networks; Internet; Zigbee; access protocols; 6LoWPAN; ID query; ID reply; IEEE 802.15.4 devices; IEEE802.15.4 standard; IPv6 address translation mechanism; IPv6 global connectivity; Internet; MAC layer; MAC payload fields; MTU; PAN L2; compress packet header; computational memory; computational power; destination addresses; energy availability; IP networks; Internet; Logic gates; Payloads; Proposals; Servers; Spread spectrum communication; 6LoWPAN; 802.15.4; Global Connectivity; IP translation; Internet Connectivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Communication Technology (ICACT), 2011 13th International Conference on
Conference_Location :
Seoul
ISSN :
1738-9445
Print_ISBN :
978-1-4244-8830-8
Type :
conf
Filename :
5745979
Link To Document :
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