DocumentCode :
1753964
Title :
Optimizing return on inspection trough defectivity smart sampling
Author :
Sahnoun, Mhamed ; Vialletelle, Philippe ; Bassetto, Samuel ; Bastoini, Soidri ; Tollenaere, Michel
Author_Institution :
G-SCOP, INP Grenoble, Grenoble, France
fYear :
2010
fDate :
18-20 Oct. 2010
Firstpage :
1
Lastpage :
4
Abstract :
In this paper we describe the use of an index to continuously monitor the risk of producing defective parts in a semiconductor production line. This index is used by product inspection policy to select the best lot to be controlled in order to decrease uncertainty on production tool´s health. The approach was tested on data straight from STMicroelectronics Crolles300 production line. We propose to evaluate the efficiency of the inspection policy based on the percentage of wafers inspected unnecessarily from the total number of inspected wafers.
Keywords :
inspection; sampling methods; semiconductor device manufacture; semiconductor industry; STMicroelectronics Crolles300; defective parts; product inspection policy; return optimization; risk index; semiconductor production line; smart sampling; wafer; Manufacturing; Robots;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing (ISSM), 2010 International Symposium on
Conference_Location :
Tokyo
ISSN :
1523-553X
Print_ISBN :
978-1-4577-0392-8
Electronic_ISBN :
1523-553X
Type :
conf
Filename :
5750233
Link To Document :
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