Title :
Defect reduction in Cu chemical-mechanical polishing
Author :
Eusner, Thor ; Saka, Nannaji ; Chun, Jung-Hoon
Author_Institution :
Lab. for Manuf. & Productivity, Massachusetts Inst. of Technol., Cambridge, MA, USA
Abstract :
The chemical-mechanical polishing (CMP) of Cu is a critical step in the manufacture of ultra-large-scale integrated (ULSI) semiconductor devices. During this process, undesirable scratches are formed on the surface being polished. Recent research suggests that the “killer” scratches found on the Cu wafers are due to the soft pad asperities and not necessarily by the hard abrasives in the slurry. Figure 1 shows examples of scratches on a Cu coating due to pad asperities. This paper presents the theory and experimental validation of scratching by soft pad asperities in Cu CMP. Based on the models and experimental results, practical solutions for mitigating scratching by pad asperities in Cu CMP are suggested.
Keywords :
ULSI; chemical mechanical polishing; coating techniques; copper; crystal defects; elastic deformation; plastic deformation; semiconductor device manufacture; wafer-scale integration; Cu; Cu wafer; chemical-mechanical polishing; coating; defect reduction; elastic deformation; killer scratch; plastic deformation; soft pad asperity; surface scratch; ultra-large-scale integrated semiconductor device manufacture; Helium; Slurries;
Conference_Titel :
Semiconductor Manufacturing (ISSM), 2010 International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4577-0392-8
Electronic_ISBN :
1523-553X