• DocumentCode
    1754172
  • Title

    3DIC multi-project fabrication run being organized by CMC/CMP/MOSIS and Tezzaron

  • Author

    Deptuch, G.

  • Author_Institution
    Fermi Nat. Accel. Lab., Batavia, IL, USA
  • fYear
    2010
  • fDate
    16-18 Nov. 2010
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    Presents a collection of slides covering the following topics: 3D IC multiproject fabrication; high energy physics; circuit bonding; wafer thinning; TSV; radiation detector; CMOS; wafer bonding; and SOI process.
  • Keywords
    nuclear electronics; particle detectors; silicon-on-insulator; three-dimensional integrated circuits; wafer bonding; 3D IC multiproject fabrication; CMOS; SOI process; TSV; circuit bonding; high energy physics; radiation detector; wafer bonding; wafer thinning; Bonding; Communities; Conferences; Detectors; Three dimensional displays; USA Councils;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    3D Systems Integration Conference (3DIC), 2010 IEEE International
  • Conference_Location
    Munich
  • Print_ISBN
    978-1-4577-0526-7
  • Type

    conf

  • DOI
    10.1109/3DIC.2010.5751419
  • Filename
    5751419
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1754172