• DocumentCode
    1754175
  • Title

    3D integration — A server perspective

  • Author

    Burns, Jack

  • Author_Institution
    VLSI Syst., IBM Res., Yorktown Heights, NY, USA
  • fYear
    2010
  • fDate
    16-18 Nov. 2010
  • Firstpage
    1
  • Lastpage
    20
  • Abstract
    A collection of slides from the author´s conference is presented. Topic discussed is about 3D integration from a server perspective.
  • Keywords
    queueing theory; three-dimensional integrated circuits; 3D integration; server; IP networks; Memory management; Servers; Silicon; System analysis and design; Three dimensional displays; Through-silicon vias;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    3D Systems Integration Conference (3DIC), 2010 IEEE International
  • Conference_Location
    Munich
  • Print_ISBN
    978-1-4577-0526-7
  • Type

    conf

  • DOI
    10.1109/3DIC.2010.5751424
  • Filename
    5751424
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1754175