• DocumentCode
    1754196
  • Title

    High density 3D integration by pre-applied Inter Chip Fill

  • Author

    Horibe, Akihiro ; Sueoka, Kuniaki ; Sakuma, Katsuyuki ; Kohara, Sayuri ; Matsumoto, Keiji ; Kikuchi, Hidekazu ; Orii, Yasumitsu ; Mitsuhashi, Toshiro ; Yamada, Fumiaki

  • Author_Institution
    Assoc. of Super-Adv. Electron. Technol. (ASET), Yamato, Japan
  • fYear
    2010
  • fDate
    16-18 Nov. 2010
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    28,561 bumps/die were electrically connected by Stack Joining method using pre-applied Inter Chip Fill resin.
  • Keywords
    three-dimensional integrated circuits; bumps/die; high density 3D integration; pre-applied inter chip fill resin; stack joining method; Resins; Silicon; Strain; Stress; Three dimensional displays; Through-silicon vias;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    3D Systems Integration Conference (3DIC), 2010 IEEE International
  • Conference_Location
    Munich
  • Print_ISBN
    978-1-4577-0526-7
  • Type

    conf

  • DOI
    10.1109/3DIC.2010.5751461
  • Filename
    5751461
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1754196