Title :
High density 3D integration by pre-applied Inter Chip Fill
Author :
Horibe, Akihiro ; Sueoka, Kuniaki ; Sakuma, Katsuyuki ; Kohara, Sayuri ; Matsumoto, Keiji ; Kikuchi, Hidekazu ; Orii, Yasumitsu ; Mitsuhashi, Toshiro ; Yamada, Fumiaki
Author_Institution :
Assoc. of Super-Adv. Electron. Technol. (ASET), Yamato, Japan
Abstract :
28,561 bumps/die were electrically connected by Stack Joining method using pre-applied Inter Chip Fill resin.
Keywords :
three-dimensional integrated circuits; bumps/die; high density 3D integration; pre-applied inter chip fill resin; stack joining method; Resins; Silicon; Strain; Stress; Three dimensional displays; Through-silicon vias;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2010 IEEE International
Conference_Location :
Munich
Print_ISBN :
978-1-4577-0526-7
DOI :
10.1109/3DIC.2010.5751461
