Development of high accuracy wafer thinning and pickup technology for thin wafer

We have evaluated accurate wafer thinning and picking up die technology around 10? m thickness. We obtained the prospect that thickness accuracy 10±1? m which is the target of the ultra thin grinding, by applying new technology like non-contact gauge or Auto TTV. The thickness distribution of the wafer with the glass achieved the sample of TTV:2.9? m, and the thickness accuracy of a real wafer became TTV:0.4? m as a result of doing BG by using non-contact gauge the Auto TTV function. Targeted value TTV:1.4? m was able to be achieved. For picking up the ultra thin dies, we found the best tool design rule and some machine condition. In picking up the ultra thin dies, the amount of the overhang of the die to the width of the slider confirmed 0.3mm was the best. The peel property of the chip edge was improved by the tension to horizontal direction in enlarging the amount of the tape expansion and picking up was improved. In addition, the peel property of the chip edge improved by slowing down the slider speed when beginning.