DocumentCode
1754203
Title
Integration of multi physics modeling of 3D stacks into modern 3D data structures
Author
Schneider, Peter ; Heinig, Andy ; Fischbach, Robert ; Lienig, Jens ; Reitz, Sven ; Stolle, Jörn ; Wilde, Andreas
Author_Institution
Design Autom. Div., Fraunhofer IIS, Dresden, Germany
fYear
2010
fDate
16-18 Nov. 2010
Firstpage
1
Lastpage
6
Abstract
This paper deals with the concept of how to integrate results of multi physics investigation of 3D stacks into modern comprehensive 3D data structures. Beside a description of modern 3D data structures and methods for floorplanning and Place&Route, approaches for multi physics modeling are introduced. The extension of the layout optimization process by multi physics modeling is investigated. Finally, we conclude with a summary of the future needs for an improved interoperability.
Keywords
circuit layout; circuit layout CAD; integrated circuit layout; 3D data structure; 3D stack; floorplanning; interoperability; layout optimization; multiphysics modeling; Analytical models; Data structures; Layout; Optimization; Physics; Solid modeling; Three dimensional displays; 3D IC; 3D data structures; Floorplanning; Place&Route; multi physics modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
3D Systems Integration Conference (3DIC), 2010 IEEE International
Conference_Location
Munich
Print_ISBN
978-1-4577-0526-7
Type
conf
DOI
10.1109/3DIC.2010.5751474
Filename
5751474
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