Title :
Equipment challenges and solutions for diverse temporary bonding and de-bonding processes in 3D integration
Author :
Gabriel, Markus ; Bisson, Thomas Knauer Peter ; Sood, Sumant ; Bair, Wilfried ; Hermanowski, Jim
Author_Institution :
SUSS Microtec Lithography GmbH, Garching, Germany
Abstract :
While several methods are available and in production for power devices, LED or other markets, 200 mm and 300 mm temporary bonding for 3D integration is a quite new field for material and equipment suppliers and challenging all participants in the supply chain. These paper presents an overview of existing and emerging processes on a flexible equipment platform to match the requirements of the end user.
Keywords :
integrated circuit bonding; three-dimensional integrated circuits; 3D integration; LED; de-bonding process; diverse temporary bonding; equipment challenges; power devices; Bonding; Cleaning; Lasers; Materials; Thermal stability; Three dimensional displays;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2010 IEEE International
Conference_Location :
Munich
Print_ISBN :
978-1-4577-0526-7
DOI :
10.1109/3DIC.2010.5751478
