Title :
Pre bonding metrology solutions for 3D integration
Author :
Riou, Gregory ; Gaudin, Gweltaz ; Landru, Didier ; Tempesta, Catherine ; Radu, Ionut ; Sadaka, Mariam ; Winstel, Kevin ; Kinser, Emily ; Hannon, Robert ; Kamenev, Boris V. ; Darwin, Michael ; Sachs, Robert
Author_Institution :
SOITEC, Grenoble, France
Abstract :
This article reports the capability and the recent development of optical profilometry for monitoring 3D integrated circuits. In particular, the capability to profile transparent film stacks, which was quite challenging, is now accessible with the Unifire optical profilometer from Nanometrics. It is demonstrated that the obtained information in term of topography and edge roll off is paramount to improving the 3D integration process. In addition, the implementation of Nanometrics´ Advanced Film Capability (AFC) and/or Index Corrected Topography (ICT) may enable more detailed mapping of local within die film thickness and topography respectively.
Keywords :
integrated circuit measurement; nanoelectronics; semiconductor thin films; three-dimensional integrated circuits; wafer bonding; wafer-scale integration; 3D integrated circuit; 3D integration; advanced film capability; circuit monitoring; die film thickness; index corrected topography; nanometrics; optical profilometry; prebonding metrology; transparent film stack; unifire optical profilometer; wafer direct bonding; Optical films; Optical imaging; Optical interferometry; Surface topography; Surface treatment; 3D integration; Metrology; Optical profilometry; Oxide Bonding;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2010 IEEE International
Conference_Location :
Munich
Print_ISBN :
978-1-4577-0526-7
DOI :
10.1109/3DIC.2010.5751484
