The ICT-BOOM project: Photonic routing on a silicon-on-insulator hybrid platform

Author

Stamatiadis, C. ; Stampoulidis, L. ; Vyrsokinos, K. ; Lazarou, I. ; Zimmermann, L. ; Voigt, K. ; Moerl, L. ; Kreissl, J. ; Sedighi, B. ; Sheng, Z. ; De Heyn, P. ; Van Thourhout, D. ; Karl, M. ; Wahlbrink, T. ; Bolten, J. ; Leinse, A. ; Heidemann, R. ; Gom

Author_Institution

Photonics Commun. Res. Lab., Nat. Tech. Univ. of Athens, Athens, Greece

fYear

2011

fDate

8-10 Feb. 2011

Firstpage

1

Lastpage

5

Abstract

BOOM is a photonic integration concept that aims to develop compact, cost-effective and power efficient silicon photonic components for high capacity routing functionalities. To accomplish this, flip-chip bonding and heterogeneous wafer scale fabrication techniques are employed that enable Si manufacturing with III-IV material processing. We present in this paper the second generation of BOOM devices that perform all-optical wavelength conversion, label processing and switching on SOI nano-wire boards.

Keywords

elemental semiconductors; flip-chip devices; integrated optics; network routing; silicon; silicon-on-insulator; ICT-BOOM project; SOI nanowire boards; all-optical wavelength conversion; flip-chip bonding; heterogeneous wafer scale fabrication; label processing; photonic integration concept; photonic routing; second generation; silicon-on-insulator hybrid platform; Driver circuits; Optical filters; Optical waveguides; Photodetectors; Photonics; Semiconductor optical amplifiers; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Optical Network Design and Modeling (ONDM), 2011 15th International Conference on

Conference_Location

Bologna

Print_ISBN

978-1-4244-9596-2

Electronic_ISBN

978-3-901882-42-5

Type

conf

Filename

5753413