• DocumentCode
    1754444
  • Title

    Post-Silicon Estimation of Spatiotemporal Temperature Variations Using MIMO Thermal Filters

  • Author

    Jaeha Kung ; Wen Yueh ; Yalamanchili, Sudhakar ; Mukhopadhyay, Saibal

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    5
  • Issue
    5
  • fYear
    2015
  • fDate
    42125
  • Firstpage
    650
  • Lastpage
    660
  • Abstract
    This paper experimentally demonstrates a methodology for proactive estimation of spatiotemporal variations in junction temperature of a silicon chip using multi-input multi-output (MIMO) thermal filters. The presented approach performs on-chip measurements to estimate the relations between power and temperature variations in the frequency domain to construct a MIMO thermal filter. The extracted filter is then used to predict spatiotemporal temperature variations from a known power pattern, even for locations without temperature sensors. The accuracy of the proposed approach is verified through a thermal emulator designed in 130-nm CMOS technology with on-chip digitally controllable power (heat) generators and temperature sensors. Using the proposed MIMO thermal filter, spatiotemporal temperature variations are accurately estimated with small error bound even at locations with no temperature sensors.
  • Keywords
    CMOS integrated circuits; elemental semiconductors; estimation theory; filters; frequency-domain analysis; silicon; temperature sensors; CMOS technology; MIMO thermal filter; Si; frequency domain analysis; junction temperature; multiinput multioutput thermal filter; on-chip digitally controllable power-heat generator; on-chip measurement; post-silicon estimation; proactive estimation; silicon chip; size 130 nm; spatiotemporal temperature variation; temperature sensor; thermal emulator design; Estimation; Heating; MIMO; Temperature measurement; Temperature sensors; Multi-input multi-output (MIMO) thermal filter; proactive thermal management; spatiotemporal temperature variations; spatiotemporal temperature variations.;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2015.2417113
  • Filename
    7095569