Investigation of Quilt Packaging Interchip Interconnect With Solder Paste

Author

Quanling Zheng ; Kopp, David ; Khan, Muhammad Asad ; Fay, Patrick ; Kriman, Alfred M. ; Bernstein, Gary H.

Author_Institution

Dept. of Electr. Eng., Univ. of Notre Dame, Notre Dame, IN, USA

Volume

4

Issue

3

fYear

2014

fDate

41699

Firstpage

400

Lastpage

407

Abstract

We investigate mechanical, thermal, and microwave characteristics of the edge-interconnect scheme called quilt packaging (QP), using a pin transfer method for the application of solder paste. A novel pull test method for QP is introduced, and the pull strength for edge copper nodules is investigated. Thermal shock tests for QP interconnects with solder are performed. Pull strengths for QP interconnects before and after thermal shock are compared and failure mechanisms of QP are investigated. The simulation and experimental results show that QP provides ultrawidebandwidth, and the use of solder paste does not significantly affect the microwave performance of QP.

Keywords

failure analysis; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; solders; thermal shock; QP interconnects; edge copper nodules; edge-interconnect scheme; failure mechanisms; mechanical characteristics; microwave characteristics; pin transfer method; pull strength; pull test method; quilt packaging interchip interconnect; solder paste; thermal characteristics; thermal shock tests; Coplanar waveguides; Electric shock; Force; Packaging; Strain; Substrates; Tin; Pull testing; quilt packaging (QP); solder paste; thermal shock;

fLanguage

English

Journal_Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-3950

Type

jour

DOI

10.1109/TCPMT.2014.2301738

Filename

6731545