MEMS-Type Self-Packaged Field-Emission Electron Source

Author

Grzebyk, Tomasz ; Gorecka-Drzazga, Anna ; Dziuban, Jan A.

Author_Institution

Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wrocław, Poland

Volume

62

Issue

7

fYear

2015

fDate

42186

Firstpage

2339

Lastpage

2345

Abstract

This paper describes a Micro-Electro-Mechanical System-type self-packaged field-emission electron source with a carbon nanotube cathode. It is a multilayer silicon-glass structure, fabricated by the use of the multiple anodic bonding process. Emission characteristics obtained for two- and three-electrode configurations have been reported. The influence of the encapsulation conditions on emission degradation in time has been investigated.

Keywords

bonding processes; carbon nanotubes; cathodes; electron field emission; electronics packaging; elemental semiconductors; encapsulation; glass; micromechanical devices; silicon; vacuum microelectronics; MEMS-type self-packaged field-emission electron source; Si; carbon nanotube cathode; encapsulation condition; microelectromechanical system; multilayer silicon-glass structure; multiple anodic bonding process; three-electrode configuration; two-electrode configuration; Anodes; Cathodes; Electron sources; Glass; Logic gates; Silicon; Field emission; micro-electro-mechanical system (MEMS); packaging; vacuum encapsulation; vacuum nanoelectronics; vacuum nanoelectronics.;

fLanguage

English

Journal_Title

Electron Devices, IEEE Transactions on

Publisher

ieee

ISSN

0018-9383

Type

jour

DOI

10.1109/TED.2015.2434598

Filename

7118157