DocumentCode :
1755219
Title :
MEMS-Type Self-Packaged Field-Emission Electron Source
Author :
Grzebyk, Tomasz ; Gorecka-Drzazga, Anna ; Dziuban, Jan A.
Author_Institution :
Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wrocław, Poland
Volume :
62
Issue :
7
fYear :
2015
fDate :
42186
Firstpage :
2339
Lastpage :
2345
Abstract :
This paper describes a Micro-Electro-Mechanical System-type self-packaged field-emission electron source with a carbon nanotube cathode. It is a multilayer silicon-glass structure, fabricated by the use of the multiple anodic bonding process. Emission characteristics obtained for two- and three-electrode configurations have been reported. The influence of the encapsulation conditions on emission degradation in time has been investigated.
Keywords :
bonding processes; carbon nanotubes; cathodes; electron field emission; electronics packaging; elemental semiconductors; encapsulation; glass; micromechanical devices; silicon; vacuum microelectronics; MEMS-type self-packaged field-emission electron source; Si; carbon nanotube cathode; encapsulation condition; microelectromechanical system; multilayer silicon-glass structure; multiple anodic bonding process; three-electrode configuration; two-electrode configuration; Anodes; Cathodes; Electron sources; Glass; Logic gates; Silicon; Field emission; micro-electro-mechanical system (MEMS); packaging; vacuum encapsulation; vacuum nanoelectronics; vacuum nanoelectronics.;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2015.2434598
Filename :
7118157
Link To Document :
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