DocumentCode
1755247
Title
Application of a New Power Distribution Scheme for Complex Printed Circuit Boards for High-Speed Signaling
Author
Zhang, David C. ; Swaminathan, Madhavan ; Keezer, David
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume
5
Issue
6
fYear
2015
fDate
42156
Firstpage
806
Lastpage
817
Abstract
This paper presents a new power distribution scheme using power transmission lines (PTLs) applied to complex printed circuit boards. The structure consists of three daughter cards stacked on a motherboard where the board-board connectors used for connection are highly inductive. We show that in spite of the inductive connections, good signal integrity (SI) and power integrity (PI) are possible without relying too much on decoupling capacitors. This is achieved using a combination of PTL that replaces the voltage planes and current steering techniques. The PTL scheme described in this paper can be used for high-speed digital signaling. The SI and PI are demonstrated for up to 3-Gbit/s transmission between the boards.
Keywords
capacitors; power transmission lines; printed circuit interconnections; printed circuits; PI; PTL scheme; SI; board-board connector; complex printed circuit board; current steering technique; daughter card; decoupling capacitor; high-speed digital signaling; inductive connection; motherboard; power distribution scheme; power integrity; power transmission line; signal integrity; voltage plane technique; Connectors; Impedance; Jitter; Resistors; Signal generators; Transmission line measurements; Vehicles; Power distribution network (PDN); power transmission line (PTL); return path discontinuity (RPD); return path discontinuity (RPD).;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2015.2431191
Filename
7118162
Link To Document