DocumentCode :
1756615
Title :
System-Level Thermal Modeling Using Nonconformal Domain Decomposition and Model-Order Reduction
Author :
Jianyong Xie ; Swaminathan, Madhavan
Author_Institution :
Interconnect & Packaging Center, Georgia Inst. of Technol., Atlanta, GA, USA
Volume :
4
Issue :
1
fYear :
2014
fDate :
Jan. 2014
Firstpage :
66
Lastpage :
76
Abstract :
To keep up with increasing modeling complexity arising from 3-D integration, novel thermal modeling methods are required to tackle large-scale 3-D systems. In this paper, we propose a system-level thermal modeling method using nonconformal domain decomposition and Krylov space-based model-order reduction (MOR) for both steady-state and transient analysis. To efficiently model a 3-D system, the system is divided into separate domains with independent meshing grids using nonconformal domain decomposition. As a result, reduced-order models can be created for individual domains with MOR ports, which can reduce the computational challenge of performing MOR for the entire system with a large number of unknowns and ports. The connectivity between domains is captured using coupling matrices via Lagrange multipliers and Schur complements. In addition, the proposed method can efficiently handle varying design parameters, such as air convection coefficient and thermal conductivity without performing parameterized MOR. The modeling results show that the proposed method can efficiently simulate 3-D systems with hundreds of ports with a speed-up of 20×, compared with just thermal modeling using domain decomposition.
Keywords :
circuit complexity; integrated circuit modelling; large scale integration; reduced order systems; thermal conductivity; thermal management (packaging); transient analysis; 3D integration; Krylov space-based model-order reduction; Lagrange multipliers; MOR ports; Schur complements; air convection coefficient; coupling matrices; design parameters; domains connectivity; large-scale 3D systems; meshing grids; modeling complexity; nonconformal domain decomposition; reduced-order models; steady-state analysis; system-level thermal modeling method; thermal conductivity; transient analysis; Atmospheric modeling; Computational modeling; Conductivity; Ports (Computers); Solid modeling; Thermal conductivity; Thermal decomposition; 3-D integration; Lagrange multiplier; design variability; model-order reduction; nonconformal domain decomposition; thermal modeling;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2013.2286158
Filename :
6662401
Link To Document :
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