• DocumentCode
    1756978
  • Title

    Modeling of Power/Ground Planes Using Triangular Elements

  • Author

    Jae Young Choi ; Swaminathan, Madhavan

  • Author_Institution
    Oracle Corp., Burlington, MA, USA
  • Volume
    4
  • Issue
    2
  • fYear
    2014
  • fDate
    Feb. 2014
  • Firstpage
    291
  • Lastpage
    302
  • Abstract
    As the operating frequency of electronic devices increases and system miniaturization continues, designing power delivery networks (PDNs) that supply quality power throughout the system becomes very challenging. To guarantee successful performance of the PDN, an accurate and time-efficient simulation method that computes the PDN impedance is required. In this paper, we propose a computationally efficient PDN modeling method that analyzes multilayer power/ground planes. The proposed method solves the differential form of Maxwell´s equation applied on the circuit representation of a plane pair. To use the analogy between the equations of the electromagnetic field and the equivalent circuit, a dual mesh is created on the metal surface. The use of a nonuniform triangular mesh enables effective discretization of multidimensional and irregular geometries. Moreover, the differential equation generates a sparse system matrix, which requires small computer resources. The proposed model is extended to multiple plane pairs, and the modeling of apertures located on any layer is also included. Simulation results show that the proposed method can solve complex structures with less computational effort than other modeling methods, while maintaining accuracy. In addition, the application of the absorbing boundary condition (ABC) to the proposed method is presented. Applying ABC to the plane boundaries prevents outgoing waves from reflecting back into the plane pair, hence removing plane resonances. The use of the first-order ABC results in a simple implementation and the results show good correlation with the results from a full-wave solver using higher order ABC.
  • Keywords
    Maxwell equations; differential equations; electromagnetic fields; equivalent circuits; mesh generation; power supply quality; sparse matrices; Maxwell equation; absorbing boundary condition; differential equation; electromagnetic field; electronic devices; equivalent circuit; full wave solver; ground planes; power delivery networks; power planes; power supply quality; sparse system matrix; system miniaturization; triangular elements; Apertures; Computational modeling; Equivalent circuits; Geometry; Integrated circuit modeling; Mathematical model; Transmission line matrix methods; Delaunay triangulation; Voronoi tessellation; electromagnetic modeling; power delivery network (PDN); power integrity;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2013.2277659
  • Filename
    6583989