DocumentCode :
1757057
Title :
A Modular 1 mm 
Die-Stacked Sensing Platform With Low Power I 
C Inter-Die Communication
Author :
Yoonmyung Lee ; Suyoung Bang ; Inhee Lee ; Yejoong Kim ; Gyouho Kim ; Ghaed, Mohammad Hassan ; Pannuto, Pat ; Dutta, Pranab ; Sylvester, Dennis ; Blaauw, D.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Univ. of Michigan, Ann Arbor, MI, USA
Volume :
48
Issue :
1
fYear :
2013
fDate :
Jan. 2013
Firstpage :
229
Lastpage :
243
Abstract :
A 1.0 mm3 general-purpose sensor node platform with heterogeneous multi-layer structure is proposed. The sensor platform benefits from modularity by allowing the addition/removal of IC layers. A new low power I2C interface is introduced for energy efficient inter-layer communication with compatibility to commercial I2C protocols. A self-adapting power management unit is proposed for efficient battery voltage down conversion for wide range of battery voltages and load current. The power management unit also adapts itself by monitoring energy harvesting conditions and harvesting sources and is capable of harvesting from solar, thermal and microbial fuel cells. An optical wakeup receiver is proposed for sensor node programming and synchronization with 228 pW standby power. The system also includes two processors, timer, temperature sensor, and low-power imager. Standby power of the system is 11 nW.
Keywords :
energy harvesting; integrated circuit interconnections; low-power electronics; microbial fuel cells; microsensors; multilayers; protocols; system buses; I2C protocols; IC layers; battery voltage down conversion; die-stacked sensing platform; general purpose sensor node platform; heterogeneous multilayer structure; interlayer communication; low power I2C inter-die communication; low-power imager; microbial fuel cells; multimodal energy harvesting; optical wakeup receiver; power 11 nW; power 228 pW; self-adapting power management unit; sensor node programming; temperature sensor; Batteries; Digital signal processing; Monitoring; Phasor measurement units; Program processors; Random access memory; Standards; Ultra-low power; smart dust; wireless sensor node;
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/JSSC.2012.2221233
Filename :
6380562
Link To Document :
