• DocumentCode
    1757544
  • Title

    Proper Metrological Methodologies to Avoid Severe Systematic Errors When Characterizing High-Power IGBTs on the Installation Field: An Introduction

  • Author

    Tenca, Pierluigi ; Chimento, Filippo

  • Author_Institution
    ABB Corp. Res., Vasteras, Sweden
  • Volume
    49
  • Issue
    3
  • fYear
    2013
  • fDate
    May-June 2013
  • Firstpage
    1438
  • Lastpage
    1451
  • Abstract
    The exigency of characterizing high-power insulated-gate bipolar transistors (IGBTs) directly on-site increasingly emerges in field installations hosting multilevel converters that employ such devices by the dozen, when not by hundreds, as it is already the reality for modern modular voltage-source HVDC and flexible ac transmission systems (FACTS). Nonetheless, differently from the actualities in permanent laboratories, the typology of the instrumentation rapidly obtainable on the field is often rather restricted by the aspects of logistic, necessary timing of intervention, and ruggedness against the usually harsh environments. Commonly, the only specimens realistically expectable at short notice on a field installation are portable curve tracers (CTs), portable field oscilloscopes with nonisolated channels, passive voltage probes, current probes based on Rogowski coils, portable multimeters, and variable dc power supplies. This paper describes metrological methodologies devised to diagnose and characterize high-power IGBTs by employing solely such a limited set of instruments. The severely erroneous conclusions that possibly descend from the utilization of CTs only are highlighted, both by experiments and by a dynamic model deduced from the nature of the specific metrological context. It is shown how the additional presence of properly connected oscilloscopes and probes becomes mandatory in order to attain a proper characterization. The role of the CTs should be strictly limited to mere stimuli generators only, also because their compensation techniques against the systematic measurement errors occurring with signal and low-power transistors rarely suffice in the case of high-power devices. Additionally, the equivalent differential capacitance between the collector and emitter terminals of a high-power IGBT-diode module is characterized too. It is often insufficiently documented in the datasheets, although its values and evolution are important for the dynamics of- the commutation. Experimental observations from an ABB 5SNA 1200G450300 IGBT module (4.5 kV and 1.2 kA) are discussed throughout the different sections in order to elucidate the details of the presented methodologies.
  • Keywords
    HVDC power convertors; insulated gate bipolar transistors; power bipolar transistors; ABB 5SNA 1200G450300 IGBT module; FACTS; Rogowski coils; compensation techniques; current 1.2 kA; current probes; data sheets; emitter terminals; equivalent differential capacitance; flexible AC transmission systems; high-power IGBT characterization; high-power IGBT-diode module; high-power devices; high-power insulated-gate bipolar transistors; low-power transistors; modular voltage-source HVDC; multilevel converters; nonisolated channels; passive voltage probes; portable curve tracers; portable field oscilloscopes; portable multimeters; systematic error metrological methodology; systematic measurement errors; variable dc power supplies; voltage 4.5 kV; Current measurement; Earth; Insulated gate bipolar transistors; Probes; Semiconductor device measurement; Systematics; Current–voltage characteristics; curve tracer; field commissioning; installations, instrumentation and measurement; insulated gate bipolar transistors; measurement techniques; multilevel converters;
  • fLanguage
    English
  • Journal_Title
    Industry Applications, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-9994
  • Type

    jour

  • DOI
    10.1109/TIA.2013.2252594
  • Filename
    6479309