Title :
Thickness-Optimized Multilevel Resistive Switching of Silver Programmable Metallization Cells With Stacked SiOx/SiO2 Solid Electrolytes
Author :
Jer-Chyi Wang ; Chun-Hsiang Chiu ; Wei-Fan Chen
Author_Institution :
Dept. of Electron. Eng., Chang Gung Univ., Taoyuan, Taiwan
Abstract :
Multilevel resistive switching (RS) characteristics of silver programmable metallization cells (Ag-PMCs) with stacked SiOx/SiO2 solid electrolytes have been investigated. Combined with conventional high/low resistance states and additional two middle resistance states (MRS1/MRS2), a multilevel cell operation of stacked-solid-electrolyte Ag-PMCs is achieved and optimized by the film thickness. Furthermore, the RS mechanism at middle resistance states has been proposed to be locally discontinuous Ag conductive filament (Ag-CF) within the stacked solid electrolytes by examining the carrier transportation and two-frequency calibrated capacitance. The stacked silicon oxide layers can prevent the Ag-CF from regeneration during the multilevel retention test, contributing to the superior retention properties to more than 104 s at 125 °C. In addition, a sequentially multilevel cycling test of more than 103 times with a resistance ratio of two orders of magnitude between each resistance state is realized by the stacked-solid-electrolyte Ag-PMCs, suitable for future high-density nonvolatile memory applications.
Keywords :
random-access storage; silicon compounds; silver; Ag; SiOx-SiO2; carrier transportation; multilevel resistive switching; nonvolatile memory; programmable metallization cells; solid electrolytes; temperature 125 C; time 104 s; Capacitance; Capacitance measurement; Resistance; Silicon; Silver; Solids; Switches; Dissipation; high-angle annular dark field (HAADF); multilevel resistive switching (RS); programmable metallization cell (PMC); silver (Ag); stacked solid electrolytes; stacked solid electrolytes.;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2015.2406794