DocumentCode :
1757986
Title :
The Development of Polymer-Based Planar Microcryogenic Coolers
Author :
Yunda Wang ; Lewis, R. ; Lin, Martin M.-H ; Radebaugh, R. ; Lee, Y.C.
Author_Institution :
Dept. of Mech. Eng., Univ. of Colorado at Boulder, Boulder, CO, USA
Volume :
22
Issue :
1
fYear :
2013
fDate :
Feb. 2013
Firstpage :
244
Lastpage :
252
Abstract :
In this paper, polymer-based microcryogenic cooler (MCC) cold stages, each with a footprint of 17 mm × 5 mm, have been successfully developed and tested. The MCC cold stage consists of a polyimide heat exchanger (HX) which is monolithically manufactured on a silicon substrate by using a polyimide/copper microelectromechanical systems process and a silicon/glass Joule-Thomson (J-T) valve which is formed with anodic bonding. Specifically, PI-2574 (HD MicroSystems) was used to make the HX in this work. The two parts are assembled together, forming a cooler which uses the J-T cycle. A cooling test with an optimized five-component mixture as the refrigerant was conducted to examine the performance of the cooler. The cooling temperature was able to reach 233 K under an operating pressure ratio of 0.7:0.15 MPa. It is one of the world´s smallest J-T cold stages and the first one fabricated and assembled based on wafer-level processes.
Keywords :
Joule-Thomson effect; cooling; copper; cryogenic electronics; heat exchangers; micromechanical devices; polymers; refrigerants; silicon; substrates; HD MicroSystems; J-T cold stages; J-T cycle; PI-2574; anodic bonding; cooling temperature; cooling test; optimized five-component mixture; polyimide heat exchanger; polyimide-copper microelectromechanical system process; polymer-based MCC cold stage; polymer-based planar microcryogenic coolers; refrigerant; silicon substrate; silicon-glass J-T valve; silicon-glass Joule-Thomson valve; temperature 233 K; wafer-level process; Fabrication; Glass; Heating; Polyimides; Silicon; Valves; Heat exchanger (HX); microcryogenic cooler (MCC); mixed refrigerant; planar; polyimide; wafer-level process;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2012.2227461
Filename :
6381425
Link To Document :
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