• DocumentCode
    1758012
  • Title

    Applications of Photoluminescence Imaging to Dopant and Carrier Concentration Measurements of Silicon Wafers

  • Author

    Lim, S.Y. ; Forster, Michael ; Zhang, Xiaobing ; Holtkamp, J. ; Schubert, Martin C. ; Cuevas, Andres ; Macdonald, Daniel

  • Author_Institution
    Res. Sch. of Eng., Australian Nat. Univ. (ANU), Canberra, ACT, Australia
  • Volume
    3
  • Issue
    2
  • fYear
    2013
  • fDate
    41365
  • Firstpage
    649
  • Lastpage
    655
  • Abstract
    Photoluminescence-based imaging is most commonly used to measure the excess minority carrier density and its corresponding lifetime. By using appropriate surface treatments, this high-resolution imaging technique can also be used for majority carrier concentration determination. The mechanism involves effectively pinning the minority excess carrier density, resulting in a dependence of the photoluminescence intensity on only the majority carrier density. Three suitable surface preparation methods are introduced in this paper: aluminum sputtering, deionized water etching, and mechanical abrasion. Spatially resolved dopant density images determined using this technique are consistent with the images obtained by a well-established technique based on free carrier infrared emission. Three applications of the technique are also presented in this paper, which include imaging of oxygen-related thermal donors, radial dopant density analysis, and the study of donor-related recombination active defects. These applications demonstrate the usefulness of the technique in characterizing silicon materials for photovoltaics.
  • Keywords
    abrasion; aluminium; carrier density; carrier lifetime; doping profiles; elemental semiconductors; etching; infrared spectra; minority carriers; photoluminescence; silicon; sputtering; Al; Si; aluminum sputtering; carrier lifetime; deionized water etching; donor-related recombination active defects; dopant concentration; free carrier infrared emission; high-resolution imaging technique; majority carrier concentration; majority carrier density; mechanical abrasion; minority carrier density; photoluminescence imaging; photoluminescence intensity; silicon wafers; spatially resolved dopant density; surface preparation; surface treatments; Imaging; Radiative recombination; Rough surfaces; Semiconductor process modeling; Silicon; Surface roughness; Surface treatment; Carrier density; photoluminescence (PL); silicon; surface recombination;
  • fLanguage
    English
  • Journal_Title
    Photovoltaics, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    2156-3381
  • Type

    jour

  • DOI
    10.1109/JPHOTOV.2012.2228301
  • Filename
    6381427