DocumentCode
1758012
Title
Applications of Photoluminescence Imaging to Dopant and Carrier Concentration Measurements of Silicon Wafers
Author
Lim, S.Y. ; Forster, Michael ; Zhang, Xiaobing ; Holtkamp, J. ; Schubert, Martin C. ; Cuevas, Andres ; Macdonald, Daniel
Author_Institution
Res. Sch. of Eng., Australian Nat. Univ. (ANU), Canberra, ACT, Australia
Volume
3
Issue
2
fYear
2013
fDate
41365
Firstpage
649
Lastpage
655
Abstract
Photoluminescence-based imaging is most commonly used to measure the excess minority carrier density and its corresponding lifetime. By using appropriate surface treatments, this high-resolution imaging technique can also be used for majority carrier concentration determination. The mechanism involves effectively pinning the minority excess carrier density, resulting in a dependence of the photoluminescence intensity on only the majority carrier density. Three suitable surface preparation methods are introduced in this paper: aluminum sputtering, deionized water etching, and mechanical abrasion. Spatially resolved dopant density images determined using this technique are consistent with the images obtained by a well-established technique based on free carrier infrared emission. Three applications of the technique are also presented in this paper, which include imaging of oxygen-related thermal donors, radial dopant density analysis, and the study of donor-related recombination active defects. These applications demonstrate the usefulness of the technique in characterizing silicon materials for photovoltaics.
Keywords
abrasion; aluminium; carrier density; carrier lifetime; doping profiles; elemental semiconductors; etching; infrared spectra; minority carriers; photoluminescence; silicon; sputtering; Al; Si; aluminum sputtering; carrier lifetime; deionized water etching; donor-related recombination active defects; dopant concentration; free carrier infrared emission; high-resolution imaging technique; majority carrier concentration; majority carrier density; mechanical abrasion; minority carrier density; photoluminescence imaging; photoluminescence intensity; silicon wafers; spatially resolved dopant density; surface preparation; surface treatments; Imaging; Radiative recombination; Rough surfaces; Semiconductor process modeling; Silicon; Surface roughness; Surface treatment; Carrier density; photoluminescence (PL); silicon; surface recombination;
fLanguage
English
Journal_Title
Photovoltaics, IEEE Journal of
Publisher
ieee
ISSN
2156-3381
Type
jour
DOI
10.1109/JPHOTOV.2012.2228301
Filename
6381427
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