• DocumentCode
    1758399
  • Title

    Improved Analytical Delay Models for RC-Coupled Interconnects

  • Author

    Feng Shi ; Xuebin Wu ; Zhiyuan Yan

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Lehigh Univ., Bethlehem, PA, USA
  • Volume
    22
  • Issue
    7
  • fYear
    2014
  • fDate
    41821
  • Firstpage
    1639
  • Lastpage
    1644
  • Abstract
    As process technologies scale into deep submicrometer region, crosstalk delay is becoming increasingly severe, especially for global on-chip buses. To cope with this problem, accurate delay models of coupled interconnects are needed. In particular, delay models based on analytical approaches are desirable, because they are not only largely transparent to technology, but also explicitly establish the connections between delays of coupled interconnects and transition patterns, thereby enabling crosstalk alleviating techniques such as crosstalk avoidance codes. Unfortunately, existing analytical delay models, such as the widely cited model in [1], have limited accuracy and do not account for loading capacitance. In this brief, we propose analytical delay models for coupled interconnects that address these disadvantages.
  • Keywords
    crosstalk; integrated circuit interconnections; integrated circuit modelling; RC-coupled interconnects; analytical delay models; crosstalk avoidance codes; crosstalk delay; on-chip buses; transition patterns; Capacitance; Crosstalk; Delays; Integrated circuit modeling; Load modeling; Wires; Bus; crosstalk; delay; interconnect; interconnect.;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2013.2275071
  • Filename
    6584808