DocumentCode
1758399
Title
Improved Analytical Delay Models for RC-Coupled Interconnects
Author
Feng Shi ; Xuebin Wu ; Zhiyuan Yan
Author_Institution
Dept. of Electr. & Comput. Eng., Lehigh Univ., Bethlehem, PA, USA
Volume
22
Issue
7
fYear
2014
fDate
41821
Firstpage
1639
Lastpage
1644
Abstract
As process technologies scale into deep submicrometer region, crosstalk delay is becoming increasingly severe, especially for global on-chip buses. To cope with this problem, accurate delay models of coupled interconnects are needed. In particular, delay models based on analytical approaches are desirable, because they are not only largely transparent to technology, but also explicitly establish the connections between delays of coupled interconnects and transition patterns, thereby enabling crosstalk alleviating techniques such as crosstalk avoidance codes. Unfortunately, existing analytical delay models, such as the widely cited model in [1], have limited accuracy and do not account for loading capacitance. In this brief, we propose analytical delay models for coupled interconnects that address these disadvantages.
Keywords
crosstalk; integrated circuit interconnections; integrated circuit modelling; RC-coupled interconnects; analytical delay models; crosstalk avoidance codes; crosstalk delay; on-chip buses; transition patterns; Capacitance; Crosstalk; Delays; Integrated circuit modeling; Load modeling; Wires; Bus; crosstalk; delay; interconnect; interconnect.;
fLanguage
English
Journal_Title
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher
ieee
ISSN
1063-8210
Type
jour
DOI
10.1109/TVLSI.2013.2275071
Filename
6584808
Link To Document