Title :
Improved Analytical Delay Models for RC-Coupled Interconnects
Author :
Feng Shi ; Xuebin Wu ; Zhiyuan Yan
Author_Institution :
Dept. of Electr. & Comput. Eng., Lehigh Univ., Bethlehem, PA, USA
Abstract :
As process technologies scale into deep submicrometer region, crosstalk delay is becoming increasingly severe, especially for global on-chip buses. To cope with this problem, accurate delay models of coupled interconnects are needed. In particular, delay models based on analytical approaches are desirable, because they are not only largely transparent to technology, but also explicitly establish the connections between delays of coupled interconnects and transition patterns, thereby enabling crosstalk alleviating techniques such as crosstalk avoidance codes. Unfortunately, existing analytical delay models, such as the widely cited model in [1], have limited accuracy and do not account for loading capacitance. In this brief, we propose analytical delay models for coupled interconnects that address these disadvantages.
Keywords :
crosstalk; integrated circuit interconnections; integrated circuit modelling; RC-coupled interconnects; analytical delay models; crosstalk avoidance codes; crosstalk delay; on-chip buses; transition patterns; Capacitance; Crosstalk; Delays; Integrated circuit modeling; Load modeling; Wires; Bus; crosstalk; delay; interconnect; interconnect.;
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
DOI :
10.1109/TVLSI.2013.2275071