• DocumentCode
    1758677
  • Title

    Power Flow Analysis and Critical Design Issues of Retrofit Light-Emitting Diode (LED) Light Bulb

  • Author

    Sinan Li ; Huanting Chen ; Siew-Chong Tan ; Hui, S. Y. Ron ; Waffenschmidt, Eberhard

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Univ. of Hong Kong, Hong Kong, China
  • Volume
    30
  • Issue
    7
  • fYear
    2015
  • fDate
    42186
  • Firstpage
    3830
  • Lastpage
    3840
  • Abstract
    For retrofit applications, some high-brightness light-emitting diode (LED) products have the same form factor restrictions as existing incandescent light bulbs. Such form factor constraints may restrict the design and optimal performance of the LED technology. In this paper, some critical design issues for commercial LED bulbs designed for replacing E27 incandescent lamps are quantitatively analyzed. The analysis involves power audits on such densely packed LED systems so that the amounts of power consumption in: 1) the LED wafer; 2) the phosphor coating; and 3) the lamp translucent cover are quantified. The outcomes of such audits enable R&D engineers to identify the critical areas that need further improvements in a compact LED bulb design. The strong dependence of the luminous output of the compact LED bulb on ambient temperature is also highlighted.
  • Keywords
    LED lamps; auditing; filament lamps; load flow; maintenance engineering; power consumption; E27 incandescent lamps; LED technology; LED wafer; ambient temperature; commercial LED bulbs; compact LED bulb design; form factor restrictions; high-brightness LED products; high-brightness light-emitting diode products; lamp translucent cover; luminous output; phosphor coating; power audits; power consumption; power flow analysis; Coatings; Electronic ballasts; Heating; Light emitting diodes; Lighting; Phosphors; Temperature; Energy audit; light-emitting diode; photo-electro-thermal theory;
  • fLanguage
    English
  • Journal_Title
    Power Electronics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-8993
  • Type

    jour

  • DOI
    10.1109/TPEL.2014.2339191
  • Filename
    6855361