DocumentCode
1759593
Title
Photonic–Electronic Integration With Bonding
Author
Fedeli, J.-M. ; Schrank, Franz ; Augendre, E. ; Bernabe, S. ; Kraft, J. ; Grosse, P. ; Enot, T.
Author_Institution
LETI, CEA, Grenoble, France
Volume
20
Issue
4
fYear
2014
fDate
July-Aug. 2014
Firstpage
350
Lastpage
358
Abstract
By co-integrating optics and electronics on the same chip, high-functionality, high-performance and highly integrated devices can be fabricated with a well-mastered microelectronics fabrication process. Different integration schemes with bonding are presented either with die-to-wafer or wafer to wafer bonding. Depending of the applications and the maturity level of the technologies, the strategies for integration will differ.
Keywords
integrated optics; integrated optoelectronics; micro-optics; microassembling; optical fabrication; silicon; wafer bonding; Si; chip; co-integrating optics; die-to-wafer; high-functionality; high-performance; highly integrated devices; integration scheme; integration strategies; maturity level; photonic-electronic integration; wafer to wafer bonding; well-mastered microelectronics fabrication process; Bonding; Copper; Metallization; Microelectronics; Photonics; Silicon; Copper bonding; InP on Si bonding; integration; silicon photonic; wafer bonding;
fLanguage
English
Journal_Title
Selected Topics in Quantum Electronics, IEEE Journal of
Publisher
ieee
ISSN
1077-260X
Type
jour
DOI
10.1109/JSTQE.2013.2295713
Filename
6734694
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