DocumentCode
1759767
Title
Integration of
Multiphase Heat Transfer Into Thermal Networks for High Current Components
Author
Kaufmann, Bonifaz ; Dreier, S. ; Haberstroh, C. ; Grossmann, S.
Author_Institution
Inst. of Electr. Power Syst. & High Voltage Eng., Tech. Univ. Dresden, Dresden, Germany
Volume
23
Issue
3
fYear
2013
fDate
41426
Firstpage
5000104
Lastpage
5000104
Abstract
Superconducting devices operating at liquid nitrogen LN2 temperature are increasingly used in power engineering. This paper describes a method to calculate the spatial distribution of temperature rise due to high current densities in electrical joints, which result in excessive transient and steady state heat generation. In order to compute heat conduction between and along adjacent solid domains, a thermal network method using analogies between thermal and electrical network is convenient. Sufficiently simple correlations for convective heat transfer coefficients are required. The given calculative approaches and principles were selected, evaluated and integrated into a thermal model. This model was approved by experimental investigations using high currents and transient cooling processes and implemented into PSpice simulation software.
Keywords
convection; critical current density (superconductivity); electrical contacts; heat conduction; nitrogen; superconducting devices; N2; PSpice simulation software; adjacent solid domains; convective heat transfer coefficients; current densities; electrical joints; electrical network; excessive transient heat generation; heat conduction; high current components; liquid nitrogen multiphase heat transfer; liquid nitrogen temperature; power engineering; spatial distribution; steady state heat generation; superconducting devices; thermal networks; Computational modeling; Conductors; Heat transfer; Joints; Mathematical model; Resistance heating; Electrical joint; heat transfer; high current; pool boiling; thermal network method;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/TASC.2012.2234191
Filename
6384689
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