• DocumentCode
    1759767
  • Title

    Integration of \\hbox {LN}_{2} Multiphase Heat Transfer Into Thermal Networks for High Current Components

  • Author

    Kaufmann, Bonifaz ; Dreier, S. ; Haberstroh, C. ; Grossmann, S.

  • Author_Institution
    Inst. of Electr. Power Syst. & High Voltage Eng., Tech. Univ. Dresden, Dresden, Germany
  • Volume
    23
  • Issue
    3
  • fYear
    2013
  • fDate
    41426
  • Firstpage
    5000104
  • Lastpage
    5000104
  • Abstract
    Superconducting devices operating at liquid nitrogen LN2 temperature are increasingly used in power engineering. This paper describes a method to calculate the spatial distribution of temperature rise due to high current densities in electrical joints, which result in excessive transient and steady state heat generation. In order to compute heat conduction between and along adjacent solid domains, a thermal network method using analogies between thermal and electrical network is convenient. Sufficiently simple correlations for convective heat transfer coefficients are required. The given calculative approaches and principles were selected, evaluated and integrated into a thermal model. This model was approved by experimental investigations using high currents and transient cooling processes and implemented into PSpice simulation software.
  • Keywords
    convection; critical current density (superconductivity); electrical contacts; heat conduction; nitrogen; superconducting devices; N2; PSpice simulation software; adjacent solid domains; convective heat transfer coefficients; current densities; electrical joints; electrical network; excessive transient heat generation; heat conduction; high current components; liquid nitrogen multiphase heat transfer; liquid nitrogen temperature; power engineering; spatial distribution; steady state heat generation; superconducting devices; thermal networks; Computational modeling; Conductors; Heat transfer; Joints; Mathematical model; Resistance heating; Electrical joint; heat transfer; high current; pool boiling; thermal network method;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2012.2234191
  • Filename
    6384689