A 3-D Split Manufacturing Approach to Trustworthy System Development

Author

Valamehr, J. ; Sherwood, Timothy ; Kastner, Ryan ; Marangoni-Simonsen, David ; Huffmire, Ted ; Irvine, Cynthia ; Levin, T.

Author_Institution

Dept. of Electr. & Comput. Eng., Univ. of California, Santa Barbara, Santa Barbara, CA, USA

Volume

32

Issue

4

fYear

2013

fDate

41365

Firstpage

611

Lastpage

615

Abstract

Securing the supply chain of integrated circuits is of utmost importance to computer security. In addition to counterfeit microelectronics, the theft or malicious modification of designs in the foundry can result in catastrophic damage to critical systems and large projects. In this letter, we describe a 3-D architecture that splits a design into two separate tiers: one tier that contains critical security functions is manufactured in a trusted foundry; another tier is manufactured in an unsecured foundry. We argue that a split manufacturing approach to hardware trust based on 3-D integration is viable and provides several advantages over other approaches.

Keywords

integrated circuit design; three-dimensional integrated circuits; 3D split manufacturing approach; catastrophic damage; computer security; hardware trust approach; integrated circuit; malicious modification; microelectronics; supply chain security; trusted foundry manufacturing; trustworthy system development; Cryptography; Foundries; Hardware; Manufacturing; Monitoring; Through-silicon vias; Advanced technologies; cryptographic controls; hardware; integrated circuits; physical security; security and privacy protection;

fLanguage

English

Journal_Title

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Publisher

ieee

ISSN

0278-0070

Type

jour

DOI

10.1109/TCAD.2012.2227257

Filename

6480852