DocumentCode
1760069
Title
Large-Signal Reliability Analysis of SiGe HBT Cascode Driver Amplifiers
Author
Oakley, Michael A. ; Raghunathan, Uppili S. ; Wier, Brian R. ; Chakraborty, Partha Sarathi ; Cressler, John D.
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume
62
Issue
5
fYear
2015
fDate
42125
Firstpage
1383
Lastpage
1389
Abstract
This paper presents the results of an investigation of the steady-state safe operating conditions for large-signal silicon-germanium (SiGe) heterojunction bipolar transistor (HBT) circuits. By calculating capacitive currents within the intrinsic transistor, avalanche inducing currents through the transistor junctions are isolated and then compared with dc instability points established through simulation and measurement. In addition, calibrated technology computer-aided design simulations are used to provide further insight into the differences between RF and dc operation and stress conditions. The ability to swing the terminals of a SiGe HBT beyond the static I-V conditions coincident with catastrophic breakdown is explained. Furthermore, hot-carrier effects are also compared from multiple perspectives, with supporting data taken from fully realized X-band and C-band cascode driver amplifiers. This analysis provides microwave circuit designers with the framework necessary to better understand the full-voltage-swing potential of a given SiGe HBT technology and the resultant hot carrier damage under RF operation.
Keywords
Ge-Si alloys; amplifiers; calibration; driver circuits; electric breakdown; heterojunction bipolar transistors; hot carriers; semiconductor device reliability; technology CAD (electronics); C-band cascode driver amplifier; DC instability; HBT cascode driver amplifier; SiGe; X-band cascode driver amplifier; calibration; capacitive current calculation; computer-aided design simulation; full-voltage-swing potential; heterojunction bipolar transistor; hot-carrier damage effect; large-signal reliability analysis; microwave circuit design; static I-V condition; Heterojunction bipolar transistors; Hot carriers; Junctions; Radio frequency; Silicon germanium; Stress; Avalanche; RF stress; SiGe; SiGe.; ballast; base leakage; breakdown; cascode; heterojunction bipolar transistor (HBT); power amplifier; reliability; safe operating area (SOA);
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2015.2407870
Filename
7057547
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