• DocumentCode
    1760101
  • Title

    Counterfeit Integrated Circuits: A Rising Threat in the Global Semiconductor Supply Chain

  • Author

    Guin, Ujjwal ; Ke Huang ; DiMase, Daniel ; Carulli, John M. ; Tehranipoor, Mohammad ; Makris, Yiorgos

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Connecticut, Storrs, CT, USA
  • Volume
    102
  • Issue
    8
  • fYear
    2014
  • fDate
    Aug. 2014
  • Firstpage
    1207
  • Lastpage
    1228
  • Abstract
    As the electronic component supply chain grows more complex due to globalization, with parts coming from a diverse set of suppliers, counterfeit electronics have become a major challenge that calls for immediate solutions. Currently, there are a few standards and programs available that address the testing for such counterfeit parts. However, not enough research has yet addressed the detection and avoidance of all counterfeit parts-recycled, remarked, overproduced, cloned, out-of-spec/defective, and forged documentation-currently infiltrating the electronic component supply chain. Even if they work initially, all these parts may have reduced lifetime and pose reliability risks. In this tutorial, we will provide a review of some of the existing counterfeit detection and avoidance methods. We will also discuss the challenges ahead for implementing these methods, as well as the development of new detection and avoidance mechanisms.
  • Keywords
    integrated circuits; reliability; risk management; supply chain management; counterfeit avoidance methods; counterfeit detection methods; counterfeit integrated circuits; electronic component supply chain; global semiconductor supply chain; globalization; reliability risk; Consumer electronics; Globalization; Hardware; Integrated circuit modeling; Integrated circuits; Semiconductor device measurement; Semiconductor devices; Supply chain management; Supply chains; AC/DC parametric tests; counterfeit integrated circuits (ICs); electrical inspection; hardware security; machine learning; path-delay test; physical inspection;
  • fLanguage
    English
  • Journal_Title
    Proceedings of the IEEE
  • Publisher
    ieee
  • ISSN
    0018-9219
  • Type

    jour

  • DOI
    10.1109/JPROC.2014.2332291
  • Filename
    6856206