Title :
Automating Stressmark Generation for Testing Processor Voltage Fluctuations
Author :
Youngtaek Kim ; John, Lizy Kurian ; Pant, Sanjay ; Manne, Srilatha ; Schulte, Michael ; Bircher, W. Lloyd ; Govindan, Madhu Saravana Sibi
Author_Institution :
Univ. of Texas at Austin, Austin, TX, USA
Abstract :
Rapid current changes (large di/dt) can lead to significant power supply voltage droops and timing errors in modern microprocessors. To test a processor´s resilience to such errors and determine appropriate operating conditions, engineers generally create manual di/dt stressmarks that have large current variations at close to the power distribution network´s resonance frequency to induce large voltage droops. This process is time-consuming and might need to be repeated several times to generate appropriate stressmarks for different system conditions (for example, different frequencies or di/dt throttling mechanisms). Furthermore, generating efficient di/dt stressmarks for multicore processors is difficult because of their complexity and synchronization issues. In this article, the authors measure and analyze di/dt issues on state-of-the-art multicore x86 systems. They present an automated di/dt stressmark generation framework called Audit to generate di/dt stressmarks quickly and effectively for multicore systems.
Keywords :
integrated circuit interconnections; integrated circuit testing; microprocessor chips; multiprocessing systems; Audit; automated di-dt stressmark generation framework; current changes; current variation; efficient di-dt stressmark generation; microprocessors; multicore processors; multicore system; multicore x86 systems; power distribution network; power supply voltage droops; processor resilience testing; processor voltage fluctuation testing; resonance frequency; throttling mechanism; timing errors; Fluctuations; Instruction sets; Multicore processing; Resonant frequency; Voltage fluctuations; Voltage measurement; Audit; di/dt; genetic algorithm; hardware measurement; inductive noise; low power; power distribution network; reliability; stressmark generation; voltage droop; voltage noise;
Journal_Title :
Micro, IEEE