• DocumentCode
    1760964
  • Title

    Superconducting Quantum Interference Devices Arranged in Pyramid Shaped Arrays

  • Author

    Berggren, Susan ; Fagaly, Robert L. ; de Escobar, Anna Leese

  • Author_Institution
    SPAWAR Syst. Center Pacific, San Diego, CA, USA
  • Volume
    25
  • Issue
    3
  • fYear
    2015
  • fDate
    42156
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    We explore SQUID array designs that could be beneficial in a robust 3-D structure involving several substrates and find a design for which there may be some advantages in linearity and dynamic range. Traditional substrates are square in shape, for a 3-D structure three squares would need to be attached together to create a structure with three sides of a cube. We explored how we would arrange an array of SQUIDs on this structure if the substrates were cut into triangles. This would result in a three-sided pyramid (or tetrahedron) shape. The arrays have a feed line at the top entering a single SQUID (or small array) and the number of SQUIDs (small arrays) increased in number each row and a decreasing critical current. We simulated the effects of varying the critical currents and SQUID loop sizes on the average response output and determined that for arrays of 21 10 × 10 bi-SQUIDs have a more linear anti-peak and larger voltage swing than a comparable size 35 × 60 array.
  • Keywords
    SQUIDs; critical currents; 3D structure; SQUID array designs; SQUID loop sizes; critical currents; pyramid shaped arrays; superconducting quantum interference devices; voltage swing; Critical current density (superconductivity); Integrated circuits; Interference; Josephson junctions; Magnetic tunneling; SQUIDs; Superconducting magnets; Modeling and Simulation; Modeling and simulation; Numerical Analysis; SQIF; SQUIDs; Superconductivity; numerical analysis; superconducting quantum interference devices (SQUIDs); superconductivity;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2014.2361490
  • Filename
    6915893