DocumentCode :
1760998
Title :
Source/Drain Series Resistance Extraction in HKMG Multifin Bulk FinFET Devices
Author :
Ping-Hsun Su ; Yiming Li
Author_Institution :
Dept. of Electr. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Volume :
28
Issue :
2
fYear :
2015
fDate :
42125
Firstpage :
193
Lastpage :
199
Abstract :
Effective extraction of source/drain (S/D) series resistance is a challenging task owing to poor epi-growth and nonuniform distribution of current density in S/D, critical limitation of restrictive design rule, ultra thin contact film, and complicated 3-D fin-type field effect transistor (FinFET) structure. In this paper, we report a test structure for measurement of linear and nonlinear S/D series resistances. This technique enables us to evaluate each component of S/D series resistance resulting from the S/D contact, the S/D epi-growth fin, the S/D extension, and the channel gate, respectively. The S/D series resistance for fins on different layout location of the same diffusion is characterized and modeled by connection with a specified S/D contact on it. Furthermore, the S/D series resistance of each fin can be analytically calculated, respectively, by swapping the S/D bias condition. The proposed test structure and extraction technique provides a robust monitoring tool to diagnose a process weak point of the 16-nm multifin high-k/metal gate bulk FinFET devices.
Keywords :
MOSFET; current density; current distribution; electric resistance measurement; high-k dielectric thin films; semiconductor device measurement; semiconductor device testing; semiconductor thin films; HKMG multifin bulk FinFET devices; S/D bias condition; S/D contact; S/D epi-growth fin; channel gate; complicated 3D fin-type field effect transistor structure; diffusion layout location; linear S/D series resistance measurement; multifin high-k-metal gate bulk FinFET devices; nonlinear S/D series resistance measurement; nonuniform current density distribution; restrictive design rule; robust monitoring tool; size 16 nm; source-drain series resistance extraction; test structure; ultra thin contact film; Conductivity; Electrical resistance measurement; FinFETs; Layout; Logic gates; Resistance; Semiconductor device measurement; Bulk FinFET; Bulk fin-type field effect transistor (FinFET); Channel fin doping; Contact size; Epi growth; Explicit model; Extraction; High-κ/metal gate; Measurement; Multi fins; Series resistance; Source/Drain resistance; Test structure; channel fin doping; contact size; epi growth; explicit model; extraction; high-k/metal gate; measurement; multifins; series resistance; source/drain (S/D) resistance; test structure;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/TSM.2015.2411711
Filename :
7057668
Link To Document :
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