Title :
Carbon Nanostructures Dedicated to Millimeter-Wave to THz Interconnects
Author :
Brun, Christophe ; Tan Chong Wei ; Franck, Pierre ; Yap Chin Chong ; Lu Congxiang ; Chow Wai Leong ; Dunlin Tan ; Tay Beng Kang ; Coquet, Philippe ; Baillargeat, Dominique
Author_Institution :
THALES, NTU, Singapore, Singapore
Abstract :
This paper focuses on the use of CNTs for new mm-to-THz interconnects for nanopackaging. To successfully integrate CNT to be in line with nanoelectronics trends, new growth processes and modeling approaches are proposed. Several experimental works are presented such as millimeter-wave flip-chip bonding. In addition, novel THz 3-D wireless interconnect, based on CNT monopole antennas, working at 200 and 300 GHz are designed, simulated, and fabricated.
Keywords :
carbon nanotubes; electronics packaging; flip-chip devices; integrated circuit bonding; interconnections; millimetre wave devices; monopole antennas; nanotube devices; terahertz wave devices; C; CNT monopole antennas; carbon nanostructures; frequency 200 GHz; frequency 300 GHz; growth processes; millimeter-wave flip-chip bonding; millimeter-wave interconnect; modeling approaches; nanoelectronics; nanopackaging; terahertz 3D wireless interconnect; Antennas; Fabrication; Gold; Integrated circuit interconnections; Integrated circuit modeling; Solid modeling; Wireless communication; 3-D interconnects; Carbon nanotubes; electromagnetic modeling; flip-chip; monopole antennas; nanopackaging; wireless interconnects;
Journal_Title :
Terahertz Science and Technology, IEEE Transactions on
DOI :
10.1109/TTHZ.2015.2407859
