Carbon Nanostructures Dedicated to Millimeter-Wave to THz Interconnects

Author

Brun, Christophe ; Tan Chong Wei ; Franck, Pierre ; Yap Chin Chong ; Lu Congxiang ; Chow Wai Leong ; Dunlin Tan ; Tay Beng Kang ; Coquet, Philippe ; Baillargeat, Dominique

Author_Institution

THALES, NTU, Singapore, Singapore

Volume

5

Issue

3

fYear

2015

fDate

42125

Firstpage

383

Lastpage

390

Abstract

This paper focuses on the use of CNTs for new mm-to-THz interconnects for nanopackaging. To successfully integrate CNT to be in line with nanoelectronics trends, new growth processes and modeling approaches are proposed. Several experimental works are presented such as millimeter-wave flip-chip bonding. In addition, novel THz 3-D wireless interconnect, based on CNT monopole antennas, working at 200 and 300 GHz are designed, simulated, and fabricated.

Keywords

carbon nanotubes; electronics packaging; flip-chip devices; integrated circuit bonding; interconnections; millimetre wave devices; monopole antennas; nanotube devices; terahertz wave devices; C; CNT monopole antennas; carbon nanostructures; frequency 200 GHz; frequency 300 GHz; growth processes; millimeter-wave flip-chip bonding; millimeter-wave interconnect; modeling approaches; nanoelectronics; nanopackaging; terahertz 3D wireless interconnect; Antennas; Fabrication; Gold; Integrated circuit interconnections; Integrated circuit modeling; Solid modeling; Wireless communication; 3-D interconnects; Carbon nanotubes; electromagnetic modeling; flip-chip; monopole antennas; nanopackaging; wireless interconnects;

fLanguage

English

Journal_Title

Terahertz Science and Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-342X

Type

jour

DOI

10.1109/TTHZ.2015.2407859

Filename

7057692