DocumentCode :
1761430
Title :
Integrated Circuit Modeling for Noise Susceptibility Prediction in Communication Networks
Author :
Fontana, Michele ; Canavero, Flavio G. ; Perraud, Richard
Author_Institution :
Dipt. di Elettron., Politec. di TorinoTorino, Turin, Italy
Volume :
57
Issue :
3
fYear :
2015
fDate :
42156
Firstpage :
339
Lastpage :
348
Abstract :
This paper addresses an integrated circuit (IC) modeling procedure for mixed-signal immunity simulations of communication networks. The procedure is based on a gray-box approach, modeling (IC) ports with a physical circuit and the internal links with a behavioral block. The parameters are estimated from time and frequency domain measurements, allowing accurate and efficient reproduction of nonlinear device switching behaviors. The effectiveness of the modeling process is verified by applying the proposed technique to a controller area network (CAN) transceiver, involved in a direct power injection (DPI) immunity test on a data communication link. The obtained model is successfully implemented in a VHDL-analog mixed-signal (AMS) solver to predict both the functional signals and the RF noise immunity at component level.
Keywords :
controller area networks; hardware description languages; integrated circuit modelling; integrated circuit noise; mixed analogue-digital integrated circuits; VHDL-analog mixed-signal solver; behavioral block; communication networks; controller area network transceiver; data communication link; direct power injection immunity test; frequency domain measurements; gray-box approach; integrated circuit modeling; internal links; mixed-signal immunity simulations; noise susceptibility prediction; time domain measurements; Immunity testing; Impedance; Integrated circuit modeling; Noise; Ports (Computers); Transceivers; CAN transceiver; RF noise immunity; VHDL-analog mixed-signal (AMS); conducted susceptibility; controller area network (CAN); electromagnetic compatibility (EMC); mixed-signal integrated circuit; signal integrity;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2015.2406664
Filename :
7058362
Link To Document :
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