DocumentCode :
1761464
Title :
2013 Electrical Insulation Conference Report
Volume :
29
Issue :
5
fYear :
2013
fDate :
September-October 2013
Firstpage :
79
Lastpage :
81
Abstract :
The 31st Electrical Insulation Conference (EIC) was held June 2 to 5 at the National Hotel in Ottawa, Ontario, Canada, with Eric David as the General Conference Chair. For the first time the EIC was sponsored entirely by the IEEE Dielectrics and Electrical Insulation Society (DEIS), although still in partnership with the National Electrical Manufacturers Association (NEMA) for the organization of the Industry Awards Banquet. There were 182 attendees and 20 exhibitors at the conference. A total of 192 abstracts were received, and 114 papers were accepted for the conference proceedings, of which 34 were presented at the Sunday evening poster session during the reception cocktail.
fLanguage :
English
Journal_Title :
Electrical Insulation Magazine, IEEE
Publisher :
ieee
ISSN :
0883-7554
Type :
jour
DOI :
10.1109/MEI.2013.6585860
Filename :
6585860
Link To Document :
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