Ultimate noise isolation in high-speed digital systems on packages and printed circuit boards

A novel idea for ultimate noise isolation in high-speed digital systems on packages and printed circuit boards (PCBs) is presented. Ultimate noise isolation in high-speed digital systems on packages and PCBs can be achieved using the following concept: `a power island surrounded by a plurality of mixed alternating impedance electromagnetic bandgap (AI-EBG) structures-based power distribution network´. In this idea, the gap around the power island provides excellent isolation from DC to the first resonant frequency of the parallel plates in packages or in PCBs and mixed AI-EBG structures provide excellent isolation from around the first resonant frequency to a substantially infinite frequency. This novel structure is designed, fabricated, and measured, which demonstrates ultimate noise isolation capability in high-speed digital systems on packages and PCBs.