Air-Filled Substrate Integrated Waveguide for Low-Loss and High Power-Handling Millimeter-Wave Substrate Integrated Circuits

An air-filled substrate integrated waveguide (SIW) made of a multilayer printed circuit board process is proposed in this paper. It is of particular interest for millimeter-wave applications that generally require low cost and low-loss performance and excellent power-handling capability. This three-layered air-filled SIW allows for substantial loss reduction and power-handling capability enhancement. The top and bottom layers may make use of a low-cost standard substrate such as FR-4 on which baseband or digital circuits can be implemented so to obtain a very compact, high-performance, low-cost, and self-packaged millimeter-wave integrated system. Over Ka-band (U-band), it is shown that the air-filled SIW compared to its dielectric-filled counterparts based on Rogers substrates RT/Duroid 5880 and also 6002 reduces losses by a mean value of 0.068 dB/cm (0.098 dB/cm) and 0.104 dB/cm (0.152 dB/cm), increases average power-handling capability by 8 dB (6 dB) and 7.5 dB (5.7 dB), and quality factor by 2.7 (2.8) and 3.6 (3.8) times, respectively. The peak power-handling capability of the proposed structure is also studied. A wideband transition is presented to facilitate interconnects of the proposed air-filled SIW with dielectric-filled SIW. Design steps of this transition are detailed and its bandwidth limitation due to fabrication tolerances is theoretically examined and established. For validation purposes, a back-to-back transition operating over the Ka-band is fabricated. It achieves a return loss of better than 15 dB and an insertion loss of 0.6 ±0.2 dB ( 0.3 ±0.1 dB for the transition) from 27 to 40 GHz. Finally, two elementary circuits, namely, the T-junction and 90 ^° hybrid coupler based on the air-filled SIW, are also demonstrated.