DocumentCode :
1762186
Title :
Noise Coupling Effects on CMOS Analog-to-Digital Converter in Magnetic Field Wireless Power Transfer System Using Chip-PCB Comodeling and Simulation
Author :
Bumhee Bae ; Kim, Jonghoon J. ; Sukjin Kim ; Sunkyu Kong ; Joungho Kim
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
Volume :
57
Issue :
3
fYear :
2015
fDate :
42156
Firstpage :
329
Lastpage :
338
Abstract :
Analog-to-digital converter (ADC) is becoming of utmost importance in an automotive environment. With the increased number of magnetic field sources near the ADC that can alter its behaviors significantly, we need to model how magnetic field affects the performance of the ADC. Therefore, in order to accurately evaluate the practical performance of the ADC and the considerable off-chip and on-chip effects that are highly complex, the chip-printed circuit board (PCB) comodeling, cosimulation, and coanalysis are required. In this study, a comodel of the magnetic field effects on an ADC is proposed. The proposed comodel includes three separate submodels: a model of the magnetic field coupling from the wireless power transfer (WPT) system input to the PCB integrated with ADC, a model of the noise coupling from the PCB to the ADC input, and a model of the ADC behavior from the ADC input to the ADC outputs. Considering the magnetic field coupling from the magnetic field source to the PCB, a new inductive transmission line model (I-TLM) method is developed. This method achieves fast, precise, and broadband estimation of the magnetic field effects in comparison to previous estimation methods. To validate the proposed comodel, an ADC is fabricated using a 0.13-μm complementary metal-oxide semiconductor process and is wire-bonded to the designed PCB for ADC. A PCB-level WPT system is designed and built as the magnetic field source. The performance factor of the ADC is measured by sweeping the WPT system input frequency from 100 kHz to 1 GHz to find out the critical WPT system frequency for the designed ADC with the chip-PCB hierarchical structure. The results estimated by the proposed model correlate well with the full 3-D electromagnetic field simulation and measurement. The proposed modeling procedure reduces the time and computation resource in the design of the chip, package, and PCB to achieve high-quality analog devices or mixed-mode systems, while also providin- an intuitive understanding of the radiated noise effect.
Keywords :
CMOS digital integrated circuits; analogue-digital conversion; circuit simulation; inductive power transmission; integrated circuit noise; magnetic field effects; printed circuit design; radiofrequency power transmission; ADC; CMOS analog-to-digital converter; I-TLM method; WPT system; automotive environment; broadband estimation; chip-PCB comodeling; chip-PCB hierarchical structure; chip-printed circuit board comodeling; complementary metal-oxide semiconductor process; frequency 100 kHz to 1 GHz; full 3D electromagnetic field simulation; high-quality analog devices; inductive transmission line model; magnetic field coupling; magnetic field effects; magnetic field sources; magnetic field wireless power transfer system; mixed-mode systems; noise coupling effects; off-chip effects; on-chip effects; radiated noise effect; size 0.13 mum; wire-bonding; Coils; Couplings; Inductance; Magnetic separation; Noise; System-on-chip; Wires; Analog–digital conversion; Analog???digital conversion; electromagnetic radiative interference; magnetic noise; transmission line modeling; wireless power transfer (WPT);
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2015.2402687
Filename :
7059196
Link To Document :
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